Equipment dimensions: L*W*H 1800*1750*2100mm

Device functions:

    • Six-sided defect detection of chips

    •Positive inspection items: substrate damage, edge chipping (length and width > 0.5*0.25mm), contamination (substrate discoloration)

    • Cracks, scratches (>10μm), and foreign objects (>10μm)

    • Backside inspection items: solder ball diameter (>50μm), solder ball contamination, oxidation, damage, missing, bridging; backside foreign objects (>10μm) chipping, missing substrate

    • Side inspection item: 5μm chipping within 5μm DCM

Performance indicators:

    • Efficiency: > 4500 dies/hour for 4-inch Tray

    • Precision: minimum detectable precision of 10μm

Technical features: compatible with chips of various sizes, specialized in algorithms, high-speed dual flow channels, patented design of loading and unloading cartridges

Application scenario: Chip defect inspection before mounting in advanced packaging and conductor manufacturing processes

Applicable products: CPU | Memory | CCD | CMOS