Equipment size: L * W * H 700 * 1200 * 1800mm

Equipment function:

    • Status detection after chip mounting

Offset detection of XY θ after chip mounting

Chip rupture, edge breakage, and dirt detection

Performance indicators:

Efficiency: UPH>180boat (based on 9die | boat, 4-layer substrate with 149 components)

    • Accuracy | Precision: Minimum measurement accuracy: 10 μ m

Technical Features:

    • Implement 100% online monitoring of patch status

Minimum measurement accuracy: 10 μ m

Measurement angle: 0.1 °

    • Automatic image focusing and image gain, eliminating manual debugging differences

Automatically create new product formulas to eliminate manual differences

Application scenario: Inspection of positional accuracy of advanced packaged semiconductor process chips after mounting

Applicable products: FCBGA, FCLGA, FCPGA CPUs, GPU products