Equipment size: L * W * H 1000 * 1000 * 1950mm

Equipment function:

    • Detection and measurement of adhesive filling between mounted chips and substrates

    • Measurement of climbing height after filling the bottom of the chip with adhesive for mounting

    • Detection of substrate damage, Die backside contamination, Die cracking, adhesive scattering, foreign objects inside the adhesive, and presence of adhesive

Performance indicators:

Efficiency: UPH>1000 units/hour (based on 3 * 6boat, 18 units)

    • Accuracy | precision: 2D minimum measurement: 50 μ m; 3D minimum measurement: 30 μ m

    • Misjudgment/overkill:<0.1%

Technical Features:

100% online monitoring of the filling status at the bottom of the underfill

    • Automatic image focusing and image gain, eliminating manual debugging differences

Wizard based creation of new product formulas, reducing the difficulty of formula creation and improving creation speed

Automatic planning of rubber road detection route

Application scenario: Inspection of the state of advanced packaged semiconductor process chips and substrate bottom after filling with adhesive

Applicable products: FCBGA, FCLGA, FCPGA CPUs, GPU products