Equipment size: L * W * H 1200 * 1200 * 2000mm

Equipment function:

    • Defect and quality inspection of adhesive dispensing for heat dissipation cover

The adhesive for the heat dissipation cover is missing, insufficient, broken, the width of the adhesive, and the adhesive offset

Colloidal height, volume, and mass

Performance indicators:

Efficiency: UPH>1000 units/hour (based on 3 * 6boat, 18 units)

    • Accuracy | precision: 2D minimum measurement: 50 μ m; 3D minimum measurement: 50 μ m

    • Misjudgment/overkill:<0.1%

Technical Features:

Online monitoring of adhesive dispensing defects and quality implementation

    • Automatic image focusing and image gain, eliminating manual debugging differences

Wizard based creation of new product formulas, reducing the difficulty of formula creation and improving creation speed

Application scenario: Defect and quality inspection of adhesive dispensing for the heat dissipation cover before advanced semiconductor encapsulation and packaging

Applicable products: FCBGA, FCLGA, FCPGA CPUs, GPU products