Equipment size: L * W * H 700 * 1200 * 1850mm

Equipment function: Check for Flux and Flux coverage on the back of mounted chips/indium chips

Performance indicators:

Efficiency: UPH>2000 units/hour (based on 3 * 6boat, 18 units)

    • Accuracy | precision: 2D minimum measurement: 50 μ m; 3D minimum measurement: 50 μ m;

    • Misjudgment/overkill:<0.1%

Technical Features:

100% online monitoring of Flux coverage status on Die/Indium sheet surface

    • Automatic image focusing and image gain, eliminating manual debugging differences

Automatically create new product formulas to eliminate manual differences

Application scenario: Pre installation inspection of heat dissipation cover in advanced packaging semiconductor process

Applicable products: FCBGA, FCLGA, FCPGA CPUs, GPU products

Adaptation process: Advanced packaging semiconductor flip chip indium wafer process