Equipment size: L * W * H 2300 * 2000 * 2200mm

Equipment function: High performance, fully automated optical inspection of semiconductor packaged integrated circuits (ICs), utilizing high-sensitivity detection of various component types and sizes through 2D and 3D measurements to determine the final packaging quality

Performance indicators:

Efficiency: 250pcs/H (QFN 120 * 120mm), 350pcs/H (BGA 75mm * 75mm)

Accuracy: The upper and lower surfaces can detect defects with a minimum thickness of 30um, and the four sides can detect defects with a minimum thickness of 30um. The 3D measurement has a repeatability accuracy of 10um;

    • Misjudgment/overkill:<2% Underkill: 0%

Technical Features:

Five track design, three unloading tracks, capable of supporting up to 5 bin levels.

Four independent detection stations and component sorting stations operating in parallel have improved detection efficiency.

High sensitivity 2D and 3D measurement capabilities ensure the accuracy of detection.

    • Unique high-precision side detection system that supports detection of BGA substrate bonding gaps, exposed copper, etc

Application scenario: Detection and quality control of packaged ICs

Applicable processes: FCBGA/WBBGA/QFN/LGA, etc