Automatic defect detection equipment for ship type vehicles
Automatic ejector pin module detection
Final appearance inspection of the chip
Chip heat dissipation cover flux detection
Automatic detection of adhesive for heat dissipation cover
Inverted chip filling adhesive detection
Chip inversion position detection
Automatic six-sided chip inspection
Fully Automated Wafer Optical Inspection Equipment
Automatic Wafer Sorter
OPE equipment
Cleaning machine loading and unloading modification equipment
E-rack equipment
E84 equipment renovation
Intelligent storage system
Tray packaging machine
Wafer packaging machine
Automatic wafer sorting machine
Autonomous Mobile Robot AMR
High altitude wafer conveyor line

Equipment size: L * W * H 2200 * 2200 * 2000mm
Equipment function:
• Fully automatic external Boat appearance and size inspection
Boat Pin is missing
• Bending
• Foreign objects, dirt, labels
• Burrs in critical areas
Performance indicators:
Efficiency: UPH>610
• Missed detection: 0
• Misjudgment/overkill:<0.1%
Technical Features:
• Can detect burrs in critical areas with a thickness of ≥ 80um, and detect defects and hidden dangers that cannot be detected by manual inspection;
• Automatic exposure technology, which can automatically calibrate the imaging contrast according to the color changes on the surface of the Boat, adapting to the wear and discoloration of the surface coating of the Boat after long-term use;
• Compatible with J-boat and M-boat
Application scenario: Advanced packaged semiconductor process line external boat full inspection
Applicable products: CPU/Memorizer/CCD/CMOS FC
Adaptation process: Off line boat full inspection
Adaptation form: Replace offline manual inspection
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