Automatic defect detection equipment for ship type vehicles
Automatic ejector pin module detection
Final appearance inspection of the chip
Chip heat dissipation cover flux detection
Automatic detection of adhesive for heat dissipation cover
Inverted chip filling adhesive detection
Chip inversion position detection
Automatic six-sided chip inspection
Fully Automated Wafer Optical Inspection Equipment
Automatic Wafer Sorter
OPE equipment
Cleaning machine loading and unloading modification equipment
E-rack equipment
E84 equipment renovation
Intelligent storage system
Tray packaging machine
Wafer packaging machine
Automatic wafer sorting machine
Autonomous Mobile Robot AMR
High altitude wafer conveyor line

Equipment size: 2900mm (L) * 1800mm (W) * 1900mm (H)
Equipment function: Cross FOUP/Cassette sorting/transfer; OCR code reading+alignment; Vacuum environment handling; MES/ECS/GEM traceability; Can connect AGV/AMR/OHCV/OHT online
Sorting efficiency: ≥ 300WPH (with OCR)
Positioning accuracy: XY ± 0.1mm, T direction ± 0.01 °
Repeat positioning: ± 0.1mm
Transport vibration: < 0.5 G
Cleanliness level: Class 1
Technical Features:
2-10 optional Loadport layouts, supporting software and mechanical structure customization
• Compatible with 4/6/8/12 inch wafers; Support SEMI standard FOUP/Cassette/SMIF;
Customization of special processes such as high temperature resistance/corrosion resistance for remote monitoring and control
MES/ECS/GEM protocol docking, full process data upload and traceability
Fully enclosed chamber+FFU purification, meeting Class 1 cleanliness requirements, suitable for dust-free workshops
• Compatible with non silicon based (SiC/GaN) wafer recognition
COPYRIGHT (©) 2020 SUZHOU WINROBS TECHNOLOGY CO., LTD Su ICP Bei 19010085-2