Automatic defect detection equipment for ship type vehicles
Automatic ejector pin module detection
Final appearance inspection of the chip
Chip heat dissipation cover flux detection
Automatic detection of adhesive for heat dissipation cover
Inverted chip filling adhesive detection
Chip inversion position detection
Automatic six-sided chip inspection
Fully Automated Wafer Optical Inspection Equipment
Automatic Wafer Sorter
OPE equipment
Cleaning machine loading and unloading modification equipment
E-rack equipment
E84 equipment renovation
Intelligent storage system
Tray packaging machine
Wafer packaging machine
Automatic wafer sorting machine
Autonomous Mobile Robot AMR
High altitude wafer conveyor line

quipment size: 8220mm (L) * 4300mm (W) * 2471mm (H)
Equipment function: OHT/manual loading of crystal round boxes, tearing labels, pasting labels, pasting desiccants, loading nylon bags, loading AL bags, labeling, unloading, realizing automated packaging of the entire line
Packaging efficiency: ≥ 25pcs/hour (8-inch FOUP, including vacuum and nitrogen filling)
Repetitive positioning accuracy: ± 0.5mm
Compatible box types: Yingte Ge Y/Xinyue Y
Communication compatibility: SECS/GEM, TCP/IP
Cleanliness level: Class 1
Technical Features:
Fully enclosed clean chamber design, built-in FFU purification and ion wind electrostatic removal system, to prevent wafer contamination
• Compatible with 6/8/12 inch wafer packaging;
FOUP/Cassette carriers are automatically loaded, positioned, and laminated without the need for manual intervention
• Automatic cutting and stacking of finished products, supporting online AMR/AGV and three-dimensional warehouse logistics docking
Upload data to MES system to achieve full process traceability and remote operation and maintenance of packaging
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