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Micro LED automatic film cutting completes BIN equipment

Equipment size: 4100mm * 1900mm * 230mm (L * W * H)

Equipment function: Used for automatic feeding, cleaning, film application, laser cutting, and performance based bin cutting of products. The equipment completes the complete process of product feeding from Tray tray to final classification and receiving through a fully automated process

Performance indicators:

    •2 × 9 connected board configuration: UPH ≥ 395 PCS

    •2 × 6 connected board configuration: UPH ≥ 341 PCS

Technical Features:

Fully automated integrated process: integrating five major processes including feeding, cleaning, film application, laser cutting, and bin sorting, reducing product handling and manual intervention

Precision laser cutting: equipped with a laser generator and a galvanometer module, combined with CCD visual positioning, to accurately cut the connected board products according to the set path; Equipped with a vertical dust extraction system to reduce dust pollution.

Intelligent Bin Sorting and Material Collection: The 4-axis robot automatically places products into corresponding Bin1~Bin6 magazines based on the Bin level information recognized by the system, and removes NG products separately, achieving intelligent classification

Modular station layout: Each station (loading, cleaning film, cutting, and bin sorting) is clearly divided into zones for easy debugging, maintenance, and efficiency optimization

Application Scenario:

MicroLED/optoelectronic device post-processing: used for performance sorting and classification of MicroLED panels or other small optical devices after cutting and splitting

Applicable products:

MicroLED Panel: Various small-sized MicroLED display panels (such as 0.13 inches, etc.) that require laser cutting and performance grading

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