Equipment dimensions: L*W*H 2100*1700*1800mm

Device functions:

    • Feed type: 8" / 12" frame wafer

    • Discharge type: JEDEC Tray / 2" 4" Waffle Pack

    • Defect detection: chipping, solder balls, cracks, FM, scratches, etc

    • Die size range: 2x2mm ~90x90mm

    • Carrier tape type: Blue tape / UV tape

Performance indicators:

    •SUPH: up to 5000±10% (backside detection)

    • PnP pressure: 60g - 300g ±10%

    • Feeding accuracy: X/Y ±30um

    • Detection accuracy: 10um

Technical Features:

    •Compatible with JEDEC Tray and 2"4" Waffle pack feeding

    • Dual PnP design, compatible with large chips while enhancing efficiency

    • Flip or no flip is selectable

    •Side Wall detection is optional

Application scenario: Advanced semiconductor packaging and testing Die sorter

Applicable products: CPU / Memory / CCD / CMOS