Equipment Name: Fully Automatic Wafer Optical Inspection Equipment

Equipment dimensions: L*W*H 2760*1850*2100mm

Device functions:

    • Incoming wafer defect inspection

    •RDL process inspection

    •Bumping process inspection

    • 2D+3D Bump finished product shipment inspection

    • Supports SECS/GEM interface protocol

Performance indicators:

    • Efficiency: 2D 30WPH@5X for 12 inch Wafer

    • 3D 10WPH for full inspection of 12-inch wafer bumps

    • Accuracy: minimum detectable defect size of 2*2 pixel, 3D repeatability accuracy of 0.3um

Technical Features:

    • Self-developed high-precision 3D algorithm, capable of detecting Bumps with a diameter of 20um and a height of 20um

    • Self-developed defect detection algorithm, combined with AI for inspection, achieving an accuracy rate of over 99%

    • Vibration suppression technology ensures that the fluctuation error is less than ±1 pixel during high-speed flying scan

    • Supports large warped wafer adsorption and AI ADC functionality

Application process: Bumping, RDL process

Applicable products: 6-inch & 8-inch, 8-inch & 12-inch bare wafers