Based on the technology precipitation in the field of optical inspection and precision operations control, as well as the accumulation of algorithm software, the company has laid a solid foundation for meeting the needs of semiconductor inspection such as optical imaging and image analysis. At the same time, the company combines the industry characteristics of high technical barriers, long verification cycle and strong customer stickiness in the semiconductor industry, deeply digs customer needs, focuses on customer pain points under the background of advanced packaging technology iteration and upgrading, and opens up a differentiated route. The company has successfully developed and delivered flip-chip metal bump detection equipment, wafer sub-micron 2D/3D measurement and defect detection equipment, achieving a breakthrough in semiconductor intelligent inspection equipment.