Product Center+
  • Semiconductor

    OPE equipment

    Cleaning machine loading and unloading modification equipment

    E-rack equipment

    E84 equipment renovation

    Intelligent storage system

    Tray packaging machine

    Wafer packaging machine

    Automatic wafer sorting machine

    Automatic defect detection equipment for ship type vehicles

    Automatic ejector pin module detection

    Final appearance inspection of the chip

    Chip heat dissipation cover flux detection

    Automatic detection of adhesive for heat dissipation cover

    Inverted chip filling adhesive detection

    Chip inversion position detection

    Automatic six-sided chip inspection

    Autonomous Mobile Robot AMR

    High altitude wafer conveyor line

    Fully Automated Wafer Optical Inspection Equipment

    Automatic Wafer Sorter

  • Optoelectronics

    FS connector dispensing machine

    UV glue curing equipment

    Stiffener dispensing machine

    Touch Post Cal testing machine

    Touchpad cleaning machine

    PCBA automatic PSA and Gel cleaning machine

    Automatic wiping and cleaning machine

    Pressure testing machine

    Automatic optical inspection equipment for metal parts

    High precision infrared coupling packaging equipment

    UV curing equipment

    Electromagnetic force testing machine

    Six sided appearance inspection equipment

    Burn In aging equipment

    High temperature aging equipment

    Micro LED automatic film cutting completes BIN equipment

    Tri color optical machine automatic alignment (AA) equipment

    Finished product testing equipment

    Transmittance testing machine

    Particle offline detection equipment

  • Product

    Touchpad function test equipment

    Gravity acceleration test equipment

    Displacement, vibration (amplitude) testing equipment

    Pressure and recovery test equipment

    High precision full size inspection equipment

    AOI testing equipment

    Appearance testing equipment

    Chip seal test automatic optical inspection equipment

    Hot melt curing assembly equipment

    Precision dispensing equipment

    High precision vacuum laminating equipment

Pressure and recovery test equipment

It is mainly used for the calibration, calibration and testing of the pressure value of the touch interactive module. The accuracy can reach ±0.5g, which can accurately detect the touch force and achieve accurate feedback with vibration displacement. At the same time, the circuit gas circuit modular quick plug design can be compatible with more product type change requirements, and reserve the option of full automatic upgrade.


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